This article reports the comparative study of surface morphology of the copper deposits using a green and a non-green solvent in an electroless copper deposition bath. The electroless copper plating was studied electrochemically using polyhydroxylic alcohol, Glycerol as the complexing agent and the reducing agents used are, a green solvent, Dimethylamineborane (DMAB) and a non-green solvent formaldehyde (HCHO). The pH of the copper methanesulphonate bath was maintained by using Potassium hydroxide as the pH adjuster. The copper electroless bath was optimized by adding stabilizers at a concentration of 1ppm at 11.50 ± 0.25 pH for DMAB and at 13.0 ± 0.25 pH for HCHO. Alanine(ALA) and Phenyl alanine(PHE) are used as stabilizers. Their effects on plating bath were studied and reported. The characterization (SEM, AFM, XRD and CV studies) shows that the deposition using DMAB contained bath showed better and eco-friendly results than the formaldehyde used deposition bath.